By Reactive Ion Etching?

Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field.

What is reactive ion etching process?

Reactive Ion Etching (RIE) uses a combination of chemical and physical reactions to remove material from a substrate; it is the simplest process that is capable of directional etching.

What is RIE used for?

Reactive ion etching (RIE) is a type of plasma etch technology used in specialty semiconductor markets for device manufacturing. Chemically reactive species (ions) are accelerated toward the substrate (usually a silicon wafer), to remove a specific deposited material.